PCB Gold Finger Protection Tape | High-Temp Kapton Masking for Soldering & SMT

Over view：

B-208G Ideal for PCB gold finger protection, this high-temp polyimide tape resists wave soldering, reflow, SMT, and hot air. It also offers excellent insulation, heat shielding, and clean peeling without residue.

Feature：

1. Withstands up to 260°C, ideal for wave soldering, reflow ovens, and hot air rework without degrading.

2. Silicone adhesive peels cleanly, leaving no residue on PCB gold fingers after high-temperature exposure.

3. Provides excellent dielectric strength and resists flux, solvents, and chemicals used in SMT and PCB manufacturing.

Application Scenarios 

1. Wave Soldering & Reflow Protection
   Used to mask PCB gold fingers during wave soldering and reflow ovens, preventing solder splash, flux contamination, and high-temperature oxidation.

2. SMT Component Heat Shielding
   Applied over heat-sensitive SMT components (e.g., switches, connectors) to deflect oven heat and protect them from damage during surface-mount assembly.

3. Hot Air Rework & Hand Soldering Masking
   Temporarily tapes around local repair areas when using hot air guns or soldering irons, providing thermal insulation and peeling off cleanly without residue.